Produktbild: Electromagnetic Compatibility Engineering
- 11%

Electromagnetic Compatibility Engineering

11% sparen

131,99 € UVP 149,00 €

inkl. gesetzl. MwSt., Versandkostenfrei


Beschreibung

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

11.09.2009

Verlag

John Wiley & Sons Inc

Seitenzahl

880

Maße (L/B/H)

24/16,1/5,1 cm

Gewicht

1455 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-0-470-18930-6

Beschreibung

Rezension

"This is an outstanding book. At 872 pages thick, it is a valuable follow up to Ott s earlier books, Noise Reduction Techniques in Electronic Systems (first edition, 1975; second edition, 1987) . . . EMC will remain with us in the foreseeable future, and we need books like this one." (The Radio Science Bulletin, 1 June 2011)

Produktdetails

Einband

Gebundene Ausgabe

Erscheinungsdatum

11.09.2009

Verlag

John Wiley & Sons Inc

Seitenzahl

880

Maße (L/B/H)

24/16,1/5,1 cm

Gewicht

1455 g

Auflage

1. Auflage

Sprache

Englisch

ISBN

978-0-470-18930-6

EU-Ansprechpartner

Zeitfracht Medien GmbH
Ferdinand-Jühlke-Straße 7
99095 Erfurt
DE
produktsicherheit@zeitfracht.de

Herstelleradresse

Wiley & Sons
1 Oldlands Way
PO22 9NQ Bognor Regis
GB
trade@wiley.com

Ein neues Kapitel für Ihre Bücher

Ein neues Kapitel für Ihre Bücher

Schenken Sie Ihren alten Schätzen ein zweites Leben: Einfach Barcode scannen, Versandetikett ausdrucken, Bücher verschicken und Thalia Geschenkkarte erhalten.

Jetzt verkaufen
Jetzt verkaufen

Kundinnen und Kunden meinen

0 Bewertungen

Informationen zu Bewertungen

Zur Abgabe einer Bewertung ist eine Anmeldung im Konto notwendig. Die Authentizität der Bewertungen wird von uns nicht überprüft. Wir behalten uns vor, Bewertungstexte, die unseren Richtlinien widersprechen, entsprechend zu kürzen oder zu löschen.

Die Bewertungen sind nach Format, Anzahl Sterne und Datum sortiert.

Verfassen Sie die erste Bewertung zu diesem Artikel

Helfen Sie anderen Kund*innen durch Ihre Meinung

Kundinnen und Kunden meinen

0 Bewertungen filtern

Die Leseprobe wird geladen.
  • Produktbild: Electromagnetic Compatibility Engineering
  • Preface xxiii

    Part 1 EMC Theory 1

    1 Electromagnetic Compatibility 3

    1.1 Introduction 3

    1.2 Noise and Interference 3

    1.3 Designing for Electromagnetic Compatibility 4

    1.4 Engineering Documentation and EMC 6

    1.5 United States' EMC Regulations 6

    1.6 Canadian EMC Requirements 19

    1.7 European Union's EMC Requirements 20

    1.8 International Harmonization 26

    1.9 Military Standards 27

    1.10 Avionics 28

    1.11 The Regulatory Process 30

    1.12 Typical Noise Path 30

    1.14 Miscellaneous Noise Sources 33

    1.15 Use of Network Theory 36

    Summary 38

    Problems 39

    References 41

    Further Reading 42

    2 Cabling 44

    2.1 Capacitive Coupling 45

    2.2 Effect of Shield on Capacitive Coupling 48

    2.3 Inductive Coupling 52

    2.4 Mutual Inductance Calculations 54

    2.5 Effect of Shield on Magnetic Coupling 56

    2.6 Shielding to Prevent Magnetic Radiation 64

    2.7 Shielding a Receptor Against Magnetic Fields 67

    2.8 Common Impedance Shield Coupling 69

    2.9 Experimental Data 70

    2.10 Example of Selective Shielding 74

    2.11 Shield Transfer Impedance 75

    2.12 Coaxial Cable Versus Twisted Pair 75

    2.13 Braided Shields 79

    2.14 Spiral Shields 81

    2.15 Shield Terminations 84

    2.16 Ribbon Cables 94

    2.17 Electrically Long Cables 96

    Summary 96

    Problems 98

    References 103

    Further Reading 104

    3 Grounding 106

    3.1 AC Power Distribution and Safety Grounds 107

    3.2 Signal Grounds 120

    3.3 Equipment/System Grounding 132

    3.4 Ground Loops 142

    3.5 Low-Frequency Analysis of Common-Mode Choke 147

    3.6 High-Frequency Analysis of Common-Mode Choke 152

    3.7 Single Ground Reference for a Circuit 154

    Summary 155

    Problems 156

    References 157

    Further Reading 157

    4 Balancing and Filtering 158

    4.1 Balancing 158

    4.2 Filtering 174

    4.3 Power Supply Decoupling 178

    4.4 Driving Capacitive Loads 186

    4.5 System Bandwidth 188

    4.6 Modulation and Coding 190

    Summary 190

    Problems 191

    References 192

    Further Reading 193

    5 Passive Components 194

    5.1 Capacitors 194

    5.2 Inductors 203

    5.3 Transformers 204

    5.4 Resistors 206

    5.5 Conductors 208

    5.6 Transmission Lines 215

    5.7 Ferrites 225

    Summary 233

    Problems 234

    References 237

    Further Reading 237

    6 Shielding 238

    6.1 Near Fields and Far Fields 238

    6.2 Characteristic and Wave Impedances 241

    6.3 Shielding Effectiveness 243

    6.4 Absorption Loss 245

    6.5 Reflection Loss 249

    6.6 Composite Absorption and Reflection Loss 257

    6.7 Summary of Shielding Equations 260

    6.8 Shielding with Magnetic Materials 260

    6.9 Experimental Data 265

    6.10 Apertures 267

    6.11 Waveguide Below Cutoff 280

    6.12 Conductive Gaskets 282

    6.13 The ''IDEAL'' Shield 287

    6.14 Conductive Windows 288

    6.16 Internal Shields 293

    6.17 Cavity Resonance 295

    6.18 Grounding of Shields 296

    Summary 296

    Problems 297

    References 299

    Further Reading 300

    7 Contact Protection 302

    7.1 Glow Discharges 302

    7.2 Metal-Vapor or Arc Discharges 303

    7.3 AC Versus DC Circuits 305

    7.4 Contact Material 306

    7.5 Contact Rating 306

    7.6 Loads with High Inrush Currents 307

    7.7 Inductive Loads 308

    7.8 Contact Protection Fundamentals 310

    7.9 Transient Suppression for Inductive Loads 314

    7.10 Contact Protection Networks for Inductive Loads 318

    7.11 Inductive Loads Controlled by a Transistor Switch 322

    7.12 Resistive Load Contact Protection 323

    7.13 Contact Protection Selection Guide 323

    7.14 Examples 324

    Summary 325

    Problems 326

    References 327

    Further Reading 327

    8 Intrinsic Noise Sources 328

    8.1 Thermal Noise 328

    8.2 Characteristics of Thermal Noise 332

    8.3 Equivalent Noise Bandwidth 334

    8.4 Shot Noise 337

    8.5 Contact Noise 338

    8.6 Popcorn Noise 339

    8.7 Addition of Noise Voltages 340

    8.8 Measuring Random Noise 341

    Summary 342

    Problems 343

    References 345

    Further Reading 345

    9 Active Device Noise 346

    9.1 Noise Factor 346

    9.2 Measurement of Noise Factor 349

    9.3 Calculating S/N Ratio and Input Noise Voltage from Noise Factor 351

    9.4 Noise Voltage and Current Model 353

    9.5 Measurment of Vn and In 355

    9.6 Calculating Noise Factor and S/N Ratio from Vn-In 356

    9.7 Optimum Source Resistance 357

    9.8 Noise Factor of Cascaded Stages 360

    9.9 Noise Temperature 362

    9.10 Bipolar Transistor Noise 364

    9.11 Field-Effect Transistor Noise 368

    9.12 Noise in Operational Amplifiers 370

    Summary 375

    Problems 376

    References 377

    Further Reading 378

    10 Digital Circuit Grounding 379

    10.1 Frequency Versus Time Domain 380

    10.2 Analog Versus Digital Circuits 380

    10.3 Digital Logic Noise 380

    10.4 Internal Noise Sources 381

    10.5 Digital Circuit Ground Noise 384

    10.6 Ground Plane Current Distribution and Impedance 391

    10.7 Digital Logic Current Flow 412

    Summary 419

    Problems 420

    References 421

    Further Reading 422

    Part 2 EMC Applications 423

    11 Digital Circuit Power Distribution 425

    11.1 Power Supply Decoupling 425

    11.2 Transient Power Supply Currents 426

    11.3 Decoupling Capacitors 431

    11.4 Effective Decoupling Strategies 436

    11.5 The Effect of Decoupling on Radiated Emissions 454

    11.6 Decoupling Capacitor Type and Value 456

    11.7 Decoupling Capacitor Placement and Mounting 457

    11.8 Bulk Decoupling Capacitors 459

    11.9 Power Entry Filters 460

    Summary 461

    Problems 461

    References 463

    Further Reading 463

    12 Digital Circuit Radiation 464

    12.1 Differential-Mode Radiation 465

    12.2 Controlling Differential-Mode Radiation 471

    12.3 Common-Mode Radiation 477

    12.4 Controlling Common-Mode Radiation 480

    Summary 488

    Problems 489

    References 490

    Further Reading 491

    13 Conducted Emissions 492

    13.1 Power Line Impedance 492

    13.2 Switched-Mode Power Supplies 495

    13.3 Power-Line Filters 511

    13.4 Primary-to-Secondary Common-Mode Coupling 523

    13.5 Frequency Dithering 524

    13.6 Power Supply Instability 524

    13.7 Magnetic Field Emissions 525

    13.8 Variable Speed Motor Drives 528

    13.9 Harmonic Suppression 536

    Summary 541

    Problems 542

    References 544

    Further Reading 544

    14 RF and Transient Immunity 545

    14.1 Performance Criteria 545

    14.2 RF Immunity 546

    14.3 Transient Immunity 557

    14.4 Power Line Disturbances 572

    Summary 575

    Problems 576

    References 578

    Further Reading 579

    15 Electrostatic Discharge 580

    15.1 Static Generation 580

    15.2 Human Body Model 587

    15.3 Static Discharge 589

    15.4 ESD Protection in Equipment Design 592

    15.5 Preventing ESD Entry 594

    15.6 Hardening Sensitive Circuits 608

    15.7 ESD Grounding 608

    15.8 Nongrounded Products 609

    15.9 Field-Induced Upset 610

    15.10 Transient Hardened Software Design 612

    15.11 Time Windows 617

    Summary 617

    Problems 619

    References 620

    Further Reading 621

    16 PCB Layout and Stackup 622

    16.1 General PCB Layout Considerations 622

    16.2 PCB-to-Chassis Ground Connection 625

    16.3 Return Path Discontinuities 626

    16.4 PCB Layer Stackup 635

    Summary 655

    Problems 657

    References 658

    Further Reading 658

    17 Mixed-Signal PCB Layout 660

    17.1 Split Ground Planes 660

    17.2 Microstrip Ground Plane Current Distribution 662

    17.3 Analog and Digital Ground Pins 665

    17.4 When Should Split Ground Planes Be Used? 668

    17.5 Mixed Signal ICs 669

    17.6 High-Resolution A/D and D/A Converters 671

    17.7 A/D and D/A Converter Support Circuitry 676

    17.8 Vertical Isolation 679

    17.9 Mixed-Signal Power Distribution 681

    17.10 The IPC Problem 684

    Summary 685

    Problems 686

    References 687

    Further Reading 687

    18 Precompliance EMC Measurements 688

    18.1 Test Environment 689

    18.2 Antennas Versus Probes 689

    18.3 Common-Mode Currents on Cables 690

    18.4 Near Field Measurements 694

    18.5 Noise Voltage Measurements 697

    18.6 Conducted Emission Testing 700

    18.7 Spectrum Analyzers 707

    18.8 EMC Crash Cart 711

    18.9 One-Meter Radiated Emission Measurements 713

    18.10 Precompliance Immunity Testing 717

    18.11 Precompliance Power Quality Tests 723

    18.12 Margin 726

    Summary 728

    Problems 729

    References 730

    Further Reading 731

    Appendix 733

    A. The Decibel 733

    B. The Ten Best Ways to Maximize the Emission from Your Product 740

    C. Multiple Reflections of Magnetic Fields in Thin Shields 743

    D. Dipoles for Dummies 746

    E. Partial Inductance 765

    F. Answers to Problems 790

    Index 825