Ardebili, H: Encapsulation Technologies for Electronic Appli

"Microelectronics packaging engineers will find this book to be a useful reference for various material properties. Those wanting to learn about electronics packaging could use this book to learn about packaging fundamentals and state-of-the-art in encapsulation for microelectronics." --IEEE Electrical Insulation Magazine

"This book describes encapsulants and packaging processes commonly used in the electronic industry. Electronic and microelectronic industry professionals, working in packaging areas will find this book to be a good source for up-to-date information on various process, testing, and quality assurance methods in the microelectronic packaging world." --IEEE Electrical Insulation Magazine