Fan-Out Wafer-Level Packaging

“It is a good resource to demonstrate the many facets of advance packaging engineering and can serve as a very informative technical reference. Valuable as a learning tool of semiconductor packaging and reliability, its clear relevance to real world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Hem Takiar, Life Cycle Reliability and Safety Engineering, June 8, 2020)

“This is a unique book written by well known & distinguished expert Dr. John Lau … reading this book will be an eye-opening journal to all who want to truly understand fan-out wafer level packaging.