Assembly and Reliability of Lead-Free Solder Joints

“The book gives a wide perspective on the technical insights of lead-free solder joint reliability and packaging approaches in the industry while adding very valuable solder joint reliability insights. It is a good resource to demonstrate the many facets of advance assembly of lead-free solders and can serve as a very informative technical reference. Valuable as a learning tool of semiconductor packaging and assembly reliability, its clear relevance to real-world industry practices make it useful for both academics and semiconductor industry practitioners.” (Chong Leong Gan and Hem Takiar, Life Cycle Reliability and Safety Engineering, July 31, 2020)